Author's: E. L. Pankratov
Pages: [1] - [26]
Received Date: October 12, 2019; Revised December 5, 2019
Submitted by:
DOI: http://dx.doi.org/10.18642/jmseat_7100122104
The paper describes an approach for increasing of density of field-effect heterotransistors in a sense-amplifier based flip-flop. To illustrate the approach we consider manufacturing of an amplifier of power in a heterostructure with specific configuration. One shall dope some specific areas of the heterostructure by diffusion or ion implantation. After that radiation defects and/or dopant should be annealed framework optimized procedure. We introduce an approach for decreasing of stress between layers of heterostructure. Also it has been considered an analytical approach for prognosis of heat and mass transport in heterostructures, which can be take into account mismatch-induced stress.
broadband power amplifier, optimization of manufacturing, increasing of element integration rate.